Microwave Technology

Microwave (MW) technology is very strategic, covering several product types across the Company's different capability areas.

Microwave technology plays a key role in SELEX Galileo's AESA radars; an important and strategic part of the Company's capability. One of the most advanced products is the TR X-Band transmit/receive modules as used in a wide range of models to support SELEX Galileo's AESA radars. The module provides gain and phase control via the GaAs 'core chip' MMIC which is controlled via a custom silicon ASIC.

The Active Electronically Scanned Antenna is the 'plank' which carries the T/R modules, antenna radiating elements and power supplies, and provides the mechanical structure and cooling infrastructure for the array.

Since the 1950s, SELEX Galileo has designed and developed technologies for high power vacuum electron devices such as magnetrons, TWT (travelling wave tubes) and klystrons. These items are employed as final stage high power amplifiers in transmitters for several systems. The available technologies allow SELEX Galileo to develop TWTs, which range from 140kW output power in S band to 14kW output power in Ku band.
SELEX Galileo also designs and develops HMIC (Hybrid Microwave Integrated Circuit) for solid state receivers, exciters and high power amplifiers. The key features of the receivers and exciters are: high dynamic, low noise figure and phase noise and compact outline.
The technologies mentioned are supported by an engineering department and a design centre equipped with the most up-to-date CAD and CAE software, for the design of microwave components and systems.

More recently a parallel capability has been developed for modern MW technology, including microwave hybrids, compact modules and sub-systems (LNA, ceramic, mixers, high isolation switch, etc), low noise oscillators and synthesisers.

SELEX Galileo is participates in the Optel consortium activity on new technology for the Tx/Rx module. All of the parts of a modern MW module will be studied, from the process for manufacturing packages and carrier to new generation components for very fast sampling (up to 1 Gsamples/sec)